Implantable MEMS sensors and medical MEMS packaging issues for future implants

BIOMEDICAL ENGINEERING-BIOMEDIZINISCHE TECHNIK(2014)

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摘要
The paper shows the potential of micro machined sensors for implantation and monitoring of patients. Next to well known sensors it is focused on inertial sensors and a way for further miniaturization keeping the performance and accuracy of the sensor. Furthermore the ongoing investigation of materials used for MEMS packaging and MEMS fabrication will be described. Here, special encapsulation techniques should show a miniaturization potential realized by the substitution of thick medical packages like Titanium housings.
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关键词
micro sensors,MEMS,biocompatibility,MEMS packaging,hermeticity,chip size package CSP,implant
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