Al Diffusion At Aln/Si Interface And Its Suppression Through Substrate Nitridation

One of the challenges for GaN-on-Si radio frequency (RF) device applications is the RF loss, which is mainly associated with a parasitic channel formed at the interface of AlN and high-resistivity Si substrates. However, the type of conductivity and formation mechanism of the parasitic channel remains controversial. Here, we report unambiguous evidence of Al diffusion at the AlN/Si interface and its effect on RF loss. Hall measurements reveal p-type conductivity at the interface. By combining with secondary ion mass spectroscopy measurements, the p-type conductivity is attributed to the Al diffusion from the AlN layers into the Si substrates, with Al being an acceptor in Si. Experimental data and simulations are in good agreement. We also demonstrate that substrate nitridation can indeed promote the formation of an amorphous silicon nitride layer, which plays a role in suppressing the Al diffusion and, thus, reducing the RF loss.