Improvement of saw damage removal to fabricate uniform black silicon nanostructure on large-area multi-crystalline silicon wafers

Xinpu Li,Ke Tao,Huayun Ge,Danni Zhang,Zhibo Gao,Rui Jia,Shengdi Chen,Zhuoyu Ji,Zhi Jin,Xinyu Liu

Solar Energy（2020）

引用 8|浏览14

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摘要

Fig. 1. SEM images of silicon wafers processed in Step1 (saw damage removal): (a) Additive Group; (b) local area of Control Group without white spots; (c) white spots of Control Group. (d) and (e) show the SEM images of silicon wafer processed after Step 5: (d) Additive Group; (e) Control Group.

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关键词

Multi-crystalline black silicon,Saw damage layer,Solar cell,Diamond wire saw,Metal-assisted chemical etching,Additive

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