A Method for Wafer Defect Detection Using Spatial Feature Points Guided Affine Iterative Closest Point Algorithm

IEEE Access, pp. 79056-79068, 2020.

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Abstract:

In integrated circuit manufacturing industry, in order to meet the high demand of electronic products, wafers are designed to be smaller and smaller, which makes automatic wafer defect detection a great challenge. The existing wafer defect detection methods are mainly based on the precise segmentation of one single wafer, which relies on ...More

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