Silicon Field Emitters fabricated by Dicing-Saw and TMAH-Etch
2020 33rd International Vacuum Nanoelectronics Conference (IVNC)(2020)
摘要
A novel silicon field emission source is presented, which is fabricated by saw dicing and TMAH-etching. Samples with different tip densities were investigated. Due to the fabrication process a higher tip density leads to a lower tip height. Very similar characteristics were observed for all different geometries. Emission currents of 10
$\mu\mathrm{A}$
are obtained at electrical fields of 6 - 8
$\mathrm{V}/\mu \mathrm{m}$
. The changes in the characteristics after 10 h at a regulated current of 10
$\mu\mathrm{m}\mathrm{A}$
and a pressure of 10–
5
mbar were investigated. The observed shift in necessary field reduces with the number of tips and is lower in p-type compared to n-type samples.
更多查看译文
关键词
semiconductor filed emission,field emitter array,emission current stability,silicon tips,emission characteristic
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要