Metal-Embedded Chiplet Assembly for Microwave Integrated Circuits
IEEE Transactions on Components Packaging and Manufacturing Technology(2020)
Key words
Transistors,Radio frequency,Integrated circuit interconnections,Gallium nitride,Manufacturing,Packaging,Metals,25-D packaging,chiplet,heterogeneous integration,millimeter-wave,monolithic microwave integrated circuit~(MMIC),power amplifier (PA)
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