Deep Learning Based Defect Detection for Solder Joints on Industrial X-Ray Circuit Board Images

2020 IEEE 18th International Conference on Industrial Informatics (INDIN)(2020)

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摘要
Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new ...
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关键词
Deep learning,Solid modeling,Three-dimensional displays,Quality control,Production,Inspection,Integrated circuit modeling
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