Nanopackaging for Component Assembly and Embedded Power in Flexible Electronics: Heterogeneous Component Integration for Flexible Systems

The trends to high-density, ultrathin, and low-cost electronic systems are currently changing the face of the mobile, security, health-care, and automotive industries. Providing a flexible platform extends the applicability of these next-generation circuits to smart displays, conformal sensors, Internet of Things (IoT) tags, remote health-monitoring systems, radar and millimeter (mm)-wave electron...