CoolSPICE : SPICE for Extreme Temperature Range Integrated Circuit Design and Modeling

A. Akturk,S. Potbhare, J. Booz,N. Goldsman, College Park, D. Gundlach,R. Nandwana, K. Mayaram

semanticscholar(2013)

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摘要
We developed a compact modeling methodology as well as a niche SPICE design suite to enable integrated circuit design for extreme environment operation. This new design suite, CoolSPICE, with its low temperature models is expected to significantly improve reliability, performance and lifetime of electronics that are used for space or low temperature niche applications. CoolSPICE with its graphical user interface including schematics editor and plotter, as shown in Fig. 1, offer a convenient and accurate way to design wide temperature range integrated circuits.
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