IMS(Injection Molded Solder:溶融はんだインジェクション法)向け 高耐熱性マスクレジストの開発 Development of liquid photoresist for IMS ( Injection Molded Solder ) with high thermal stability 武川 純*

With the demand increasing significantly in big data for the Internet of Things(IoT), advanced packaging technology of 2.5D or 3DIC TSV structures and fan-out wafer level packaging technology have been studied and developed 1)~ . The interconnection in advanced packaging has recently begun being stacked in the z direction, so packaging structures and their fabrication processes have become more and more complicated. Also, the number of I/O and other functionalities of devices are increasing, which encourages downsizing of the metal wiring width/space and bump size/pitch. IMS(Injection Molded Solder:溶融はんだインジェクション法)向け 高耐熱性マスクレジストの開発