Novel Chemical Mechanical Polishing/Plasma- Chemical Vaporization Machining (CMP/P-CVM) Combined Processing of Hard-to-Process Crystals Based on Innovative Concepts

Toshiro K. Doi,Yasuhisa Sano, Syuhei Kurowaka,Hideo Aida,Osamu Ohnishi,Michio Uneda, Koki Ohyama

SENSORS AND MATERIALS（2014）

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摘要

1Kyushu University, KASTEC, 6-1 Kasuga-Koen, Kasuga-shi, Fukuoka 816-8580, Japan 2Osaka University, 1-1 Yamadaoka, Suita-shi, Osaka 565-0871, Japan 3Kyushu University, Ito Campus, 744 Motoka, Nishi-ku, Fukuoka 819-0395, Japan 4Namiki Precision Jewel Co., Ltd., 3-8-22 Shinden, Adachi-ku, Tokyo 123-8511, Japan 5Miyazaki University, 1-1 Gakuen Kibanadai-nishi, Miyazaki 889-2192, Japan 6Kanazawa Institute of Technology, 7-1 Ohgigaoka, Nonoichi-shi, Ishikawa 921-8501, Japan

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关键词

chemical mechanical polishing (CMP),plasma-chemical vaporization machining (P-CVM),combined processing,hard-to-process crystals,pseudoradical area,removal rate,surface roughness,ultraprecision processing

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