Light based synthesis of metallic nanoparticles on surface-modified 3D printed substrates for high performance electronic systems

•High-resolution conformal and flexible electronic circuitry on 3D printed substrate.•Electrical, mechanical and thermal performance suitable for real-world applications.•First example of surface mount packaging using solder reflow with 3D printed parts.•Overcomes the restrictions of directly depositing conductive pastes and inks.•Wide range of practical electronic applications demonstrated.