Investigation into how the Floor Plan Layout of a Manufactured PCB Influences Flip Chip Susceptibility to Vibration

Kangkana Baishya,David M. Harvey,Guangming Zhang,Derek R. Braden

IEEE Transactions on Components, Packaging and Manufacturing Technology（2020）

引用 4|浏览13

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摘要

This article investigates how floor plan layout of a printed circuit board (PCB) influences the reliability of the component's solder joint connections when operated in a vibrating environment. A random vibration profile as seen in an automotive environment was used in full lifetime tests. An industry-standard FR4 PCB with electroless nickel immersion gold (ENIG) surface finish was manufactured wi...

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关键词

Flip-chip devices,Reliability,Vibrations,Soldering,Layout,Fatigue,Acoustics

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