Structural and Transport Properties of Cu/Ta(N)/Cu Interfaces in Vertical InterconnectsNicholas A. Lanzillo,Lawrence Clevenger,Robert R. Robison,Daniel C. EdelsteinJOURNAL OF APPLIED PHYSICS（2020）引用 4|浏览76AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
