Real-time monitoring for the CFRP/aluminium-alloy bonding structure during curing process using encapsulated fiber Bragg grating sensor

•A special packaging sensor monitoring system based on FBG is proposed.•The coupling of temperature and strain is solved.•The experiment combined with theoretical analysis accurately described the change process of adhesive.•The gel temperature of the adhesive layer is got.•The residual strain is obtained accurately by the monitoring system.