13.3 A 22nm 32Mb Embedded STT-MRAM with 10ns Read Speed, 1M Cycle Write Endurance, 10 Years Retention at 150°C and High Immunity to Magnetic Field Interference.

ISSCC(2020)

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摘要
STT-MRAM is a promising solution for next-generation embedded non-volatile memory (NVM), supporting a wide range of applications. Compared to traditional embedded Flash [1]–[2], STT-MRAM is a CMOS-compatible low-temperature back-end-of-the-line (BEOL) memory, requiring only 2-to-5 extra masks. It is a byte-alterable NVM with excellent write speed, write endurance (\u003e1M cycles), and high-temperature data retention capability. In this work, a 32Mb STT-MRAM using a 0.0456µm2 bit cell is fabricated using a 22nm ultra-low leakage (ULL) CMOS process. A WL-voltage generation system, with distributed local constant-current kickers, and power-gating switches is used to overdrive the WL to achieve a higher read margin, while maintaining low-standby current and fast wake-up. Sense amplifiers (SAs) with segment trimming and adaptive timing control are designed to support reliable reads from −40 to 125°C. A smart write, with multiple write pulses controlled by adaptive write-verify and a temperature compensated write bias, is used for efficient write operation. Magnetic field interference is reduced by six orders of magnitude by adding a shielding film to the packaged die.
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关键词
adaptive write-verify,temperature compensated write bias,shielding film,multiple write pulses,smart write,segment trimming,adaptive timing control,sense amplifiers,power-gating switches,distributed local constant-current kickers,BEOL memory,CMOS-compatible low-temperature back-end-of-the-line memory,next-generation embedded nonvolatile memory,read speed,write endurance,embedded STT-MRAM,magnetic field interference,efficient write operation,fast wake-up,low-standby current wake-up,read margin,constant-current kickers,WL-voltage generation system,ultra-low leakage CMOS process,high-temperature data retention capability,byte-alterable NVM,2-to-5 extra masks,packaged die,ultra-low leakage CMOS process,ULL CMOS process,traditional embedded flash,temperature 150.0 degC,current 13.3 A,size 22.0 nm,time 10.0 ns,size 0.0456 mum,temperature -40.0 degC to 125.0 degC,storage capacity 32 Mbit,time 10 year
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