A 7-nm 4-GHz Arm¹-Core-Based CoWoS¹ Chiplet Design for High-Performance Computing.

We present a dual-chiplet interposer-based system-in-package (SiP) octo-core processor using Chip-on-Wafer-on-Substrate (CoWoS) technology. Each of the two identical chiplets is implemented in 7-nm CMOS with 15 metal layers and has four Arm Cortex-A72 processor cores operating at 4.0 GHz. A bidirectional mesh bus with 2-mm flop-to-flop distance is distributed throughout the chiplet for high-speed ...