Inter-tier Dynamic Coupling and RF Crosstalk in 3D Sequential Integration

P. Sideris,J. Lugo-Alvarez,P. Batude,L. Brunet,P. Acosta-Alba,S. Kerdiles,C. Fenouillet-Beranger,G. Sicard,O. Rozeau,F. Andrieu,J-P. Colinge,G. Ghibaudo,C. Theodorou

IEEE Conference Proceedings（2019）

Cited 6|Views63

Key words

TCAD simulations,heterogeneous 3DSI integration,strategically designed polysilicon Ground Plane,inter-tier RF crosstalk,3D sequential 2-bitcell SRAM cell circuit configuration,dynamic coupling effects,3D sequential integration,inter-tier dynamic coupling,frequency 100.0 GHz,size 34 nm

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