Additively Manufactured mm-Wave Multichip Modules With Fully Printed ``Smart'' Encapsulation Structures
IEEE Transactions on Microwave Theory and Techniques(2020)
摘要
This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand “smart” encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical re...
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关键词
Integrated circuit interconnections,Encapsulation,Radio frequency,Substrates,Three-dimensional printing
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