The Role of Oxide Formation on Insulating Versus Metallic Substrates During Co and Ru Selective ALD

Steven Wolf,Michael Breeden,Scott Ueda,Jacob Woodruff,Mansour Moinpour,Ravindra Kanjolia,Andrew Kummel

Applied Surface Science（2020）

引用 10|浏览12

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摘要

•Novel, selective Ru ALD from HCOOH or TBA and RuDMBD(CO)3.•Hyper-selective Co ALD due to the formation of CoOx on insulator.•No etching of Cu substrates observed by using TBA as co-reactant.

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关键词

ALD,Cobalt,Ruthenium,Bottom-up fill,Organometallic,XPS

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