Wafer Level Characterization Of Row-Column Addressed Cmut Arrays

This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device. This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.