EMI Suppression with Distributed LLC Resonant Converter for High Voltage VR-on-Package

Kan Xu,Boris Vaisband,Gregory Sizikov,Xin Li,Eby G. Friedman

IEEE Transactions on Components, Packaging and Manufacturing Technology（2020）

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摘要

Higher on-chip current demand leads to lower power efficiency of the power delivery network due to distribution losses within the current path. A high-voltage power architecture and voltage regulator (VR)-on-package topology can increase system power efficiency by reducing distribution losses. Electromagnetic interference (EMI) can, however, be a significant challenge due to the high-voltage injec...

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关键词

Electromagnetic interference,Resonant converters,Topology,System-on-chip,Resistance,Voltage control,Inductors

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