D-band Waveguide-to-microstrip Transition Implemented in eWLB Packaging Technology

Ahmed Hassona,Vessen Vassilev,Zhongxia Simon He,Ashraf Zaman,Chiara Mariotti,Franz Dielacher,Herbert Zirath

Electronics Letters（2020）

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摘要

This Letter presents a non-galvanic D-band (110-170 GHz) interconnect realised in embedded wafer level ball grid array (eWLB) packaging technology. The interconnect consists of a patch-radiator-based waveguide transition implemented using one of the technology's redistribution layers. The patch radiates to a WR-6.5 standard waveguide perpendicular to its plane. An electromagnetic band-gap structur...

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关键词

ball grid arrays,field effect MIMIC,microstrip transitions,photonic band gap,wafer level packaging,waveguide transitions

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