Inter-tier Electrostatic Coupling Effects in 3D Sequential Integration Devices and Circuits
SOLID-STATE ELECTRONICS（2020）
Key words
SOI,CMOS,Fully depleted,S3D,Monolithic 3D,3D sequential integration,Stacked,Coupling,SRAM cells,Static random access memory,RSNM,WSNM,SRRV,Circuit stability
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