Experimental study of simultaneous measuring of film Young’s modulus and adhesion by the Non-destructive CZM-SAW technique

The surface acoustic wave (SAW) technique is valuable to determine the property of thin film because it requires only elastic deformation. It features non-destructive measurement, easy operation, time-saving and isolates substrate coupling. In the recent study, the surface acoustic wave technique with cohesive zone model (CZM-SAW) is proposed to measure the film Young's modulus and adhesion simultaneously. In this study, the simultaneous CZM-SAW technique is further studied by the experimental study. The experimental results show that for the film with bad adhesion property and porous low-k film with lower Young's modulus, for the reliability of measuring results, it is highly required to use simultaneous CZM-SAW technique to measure the film Young's modulus and adhesion. Moreover, the film test results are compared with nano-indentation test and nano-scratch test. By comparison, the unique advantages of the CZM-SAW technique are well demonstrated.