A novel approach for copper protection: UV light triggered preparation of the click-assembled film on copper surface

Self-assembling process has been wildly used in the metal protection, and the better approaches to improve the assembled film are always explored. In this paper, a novel click-assembled approach triggered by UV light on copper surface is present. The results show the thiol-yne click reaction between dithiothreitol (DTT) and tertbutyl acetylene (TBA) is triggered on copper surface under the exposure of 365 nm UV light. The newly generated C-S bonds connect the inhibitor molecules on copper surface to form the thioether (TTA) film, the protective efficiency is 96.0%. This assembled approach triggered by light provides a new idea for the metal protection.