An Enhanced Differential Surface Admittance Operator for the Signal Integrity Modeling of Interconnects

2019 International Conference on Electromagnetics in Advanced Applications (ICEAA)(2019)

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摘要
A new, enhanced formulation of the 3-D differential surface admittance operator is presented in this contribution. By employing closed expressions for the sums of the infinite series that arise from discretizing the operator by means of entire domain basis functions, a more efficient and accurate form is obtained. Convergence analysis demonstrates the performance gain. Additionally, the appositeness of the novel operator is studied by analyzing results for various interconnect structures over a broad frequency range and by comparing with other research and commercial solvers.
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关键词
3-D surface admittance,boundary integral equation (BIE),interconnect modeling
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