Preparation and Properties of 3D Screen-Printed RF Components

M. Dressler,T. Studnitzky, M. Staeter,O. Peverini,G. Addamo, H.-U. Nickel

2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)（2019）

引用 3|浏览29

暂无评分

摘要

This paper reports on the preparation procedure of 3D screen printed RF copper components which were (i) printed in stainless steel and subsequently copper plated, and (ii) printed directly in copper. The RF properties were measured and showed promising results for insertion loss and reflection coefficient.

查看译文

关键词

filters,electronic equipment manufacture

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要