Statistical Models of Overdispersed Spatial Defects for Predicting the Yield of Integrated Circuits

IEEE Transactions on Reliability(2020)

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摘要
Defects generated in semiconductor manufacturing processes have serious effects on the yield of integrated circuits (ICs). Accurate modeling of the defect counts on IC chips is crucial for predicting the yield. The conventional Poisson yield model tends to underestimate the true yield by ignoring overdispersed patterns of defects on the wafer. This article uses various models based on the generali...
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关键词
Integrated circuit modeling,Semiconductor device modeling,Predictive models,Dispersion,Manufacturing
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