Effect of nano-ZnO particles on wettability, interfacial morphology and growth kinetics of Sn–3.0Ag–0.5Cu–xZnO composite solder

Min Qu,Tianze Cao,Yan Cui,Fengbin Liu,Zhiwei Jiao

Journal of Materials Science: Materials in Electronics（2019）

引用 21|浏览2

暂无评分

摘要

The influence of nano-ZnO particles addition on wettability, thermal behavior and interface morphology of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder were investigated in present study. SAC305-xZnO composite solder with five different mass fractions of nano-ZnO particles ranging from 0 to 2.0 wt

查看译文

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要