Low temperature junctionless device stacking enabled by leading edge sequential 3D integration

Sequential or monolithic 3D integration requires a combination of advanced manufacturing processes and highly reliable integration scheme at both device and substrate level. In order to achieve this, front-end layer transfer technology looks as key element of 3D integration flow. In this paper, we will bring an insight on technology challenges as well as solutions to enable sequential 3D device integration. We will also exhibit successful demonstration of low temperature device stacking using junctionless top devices.