Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips

Zihao Yuan
Zihao Yuan
Geoffrey Vaartstra
Geoffrey Vaartstra
Prachi Shukla
Prachi Shukla
Mostafa Said
Mostafa Said

intersociety conference on thermal and thermomechanical phenomena in electronic systems, 2019.

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