ADVANCED MULTIFUNCTIONAL TEMPORARY BONDING MATERIALS WITH HETEROGENEOUS INTEGRATED PROPERTIES FOR VARIOUS ADVANCED PACKAGING APPLICATIONS
2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC)（2019）
关键词
advanced multifunctional temporary bonding materials,heterogeneous integrated properties,advanced packaging applications,unique properties,technical enablers,long-lasting demand,future semiconductor development,single-component material,newly developed materials,diversified advanced packaging platforms,semiconducting advanced packaging platforms,fan-in wafer-level packaging,fan-out wafer-level packaging,embedded die,through-silicon vias,redistribution layer-first fan-out,RDL-first fan-out
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要