Laser-assisted stress reduction in molybdenum microstructures for CMOS compatible MEMS integration
Sensors and Actuators A: Physical(2019)
摘要
The proposed experimental work is focused to develop a promising solution to obtain stress-free metal based MEMS (released) structures on top of the CMOS wafers without affecting the underneath CMOS layers (that is the main requirement for CMOS-MEMS integration).
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关键词
CMOS-MEMS,Beam bending,Laser annealing,Molybdenum,Temperature
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