Where is the Sweet Spot for Panel Level Packaging?

T Braun,K. -F. Becker,O. Hoelck, S. Voges, M. Woehrmann, L. Boettcher, M. Toepper, L. Stobbe,R. Aschenbrenner, M. Schneider-Ramelow, K. -D. Lang

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)（2019）

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摘要

Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration including multiple die packaging, passive component integration in package and redistribution layer or package-on-package approaches also larger rectangular substrates formats are targeted.

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关键词

Packaging,Market research,Liquid crystal displays,Wafer scale integration,Microelectronics,Liquids,Lithography

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