Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package

Kai-Ming Yang,Tzu-Chieh Chou,Cheng-Ta Ko,Chen-Hao Lin,Yu-Hua Chen,Tzyy-Jang Tseng,Wen-Wei Wu,Kuan-Neng Chen

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)（2019）

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摘要

In this paper, low temperature (190-220°C) Cu-Cu gang bonding at a low vacuum pressure is demonstrated. The low temperature technologies can be applied to the RDL-first Fan-Out panel level package (FOPLP).

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关键词

Bonding,Substrates,Glass,Reliability,Bonding forces,Electric variables,Contacts

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