Decrease of energy deposited during laser decapsulation attacks by dyeing and pigmenting the ECA: Application to the forensic micro-repair of wire bonding

Th. Heckmann, Th. Souvignet,D. Naccache

Digital Investigation(2019)

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摘要
Polymeric adhesives are of interest in the digital forensics domain. They can be used to perform more or less complex repairs or even to realise advanced man-in-the-middle attacks in order to carry out reverse engineering of secure systems (Heckmann et al., 2017).
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关键词
Forensic repair,Hardware Forensics,Adhesives properties
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