LoCool: Fighting Hot Spots Locally for Improving System Energy Efficiency

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems(2020)

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摘要
Elevated on-chip temperatures significantly degrade performance, energy-efficiency, and lifetime of processors. The cooling system for a chip is typically designed to remove the worst-case heat generated per unit area. Cooling demand, however, spatially and temporally varies across a chip as hot spots occur on different locations with different intensities. Thus, designing a homogeneous cooling sy...
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关键词
Liquid cooling,Microchannels,Optimization,Integrated circuit modeling,Heating systems,Runtime
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