A Novel Double-layered Heat Sink for High Power Electronics

A novel design of double-layered heat sink with staggered circular pin fins (DL-CPFHS) is presented in this work and its thermal performance is numerically investigated. The thermal performance of DL-CPFHS is compared with the commonly used double-layered micro-channel heat sink (DL-MCHS) under same overall geometric dimensions. The maximum wall temperature of DL-CPFHS is 5.3 K lower than that of DL-MCHS under the pumping power of 0.01 W, which indicates a 14.3% lower thermal resistance of DL-CPFHS compared to DL-MCHS. The ratio of thermal resistance of DL-CPFHS to thermal resistance of DL-MCHS decreases from 0.86 to 0.80 as the pumping power varying from 0.01 to 0.05 W, which means DL-CPFHS has a lower thermal resistance and this advantage becomes much more obvious under a higher pumping power.