Teraphy: A High-Density Electronic-Photonic Chiplet For Optical I/O From A Multi-Chip Module
2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC)(2019)
摘要
In this work, we provide an overview of System-in-Package (SiP) integration of an electronic-photonic chiplet fabricated in a commercial CMOS foundry. Assembly considerations, including co-packaging in a standard multi-chip module (MCM) package with a System-on-Chip (SoC), thermals, and fiber attach will be reviewed.
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关键词
commercial CMOS foundry,TeraPHY,high-density electronic-photonic chiplet,SoC,MCM packaging,SiP integration,optical I-O,system-in-package integration,system-on-chip,multichip module packaging,assembly
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