Novel metallization processes for sub-100 nm magnetic tunnel junction devices

In this work, a novel method consisting of side-wall passivation and a top-metal reveal process is proposed for spintronics devices based on magnetic tunnel junctions (MTJs). The method can efficiently protect ferromagnetic metals and magnesium oxide, which are the key materials of MTJs, and effectively establish electrical contact with the interconnect metals for perpendicular MTJs (p-MTJs). The scheme consists of the passivation of MTJs with dual dielectrics – silicon nitride and silicon oxide – followed by planarization and selective wet etching. The proposed integration scheme was successfully demonstrated with 80-nm-diameter p-MTJ devices.