Circuit Level Esd Simulation With Spice: Successes And Challenges
2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)(2018)
摘要
The present state of compact device modelling for circuit level ESD simulation with SPICE has been reviewed. An industry perspective on the key factors that are important for successful ESD event simulation is provided. The main challenges for the future ESD model developments are also discussed,
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关键词
circuit level ESD simulation,SPICE,successful ESD event simulation,ESD model developments
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