A Bandwidth-Dense, Low Power Electronic-Photonic Platform and Architecture for Multi-Tbps Optical I/O

Mark Wade,Michael Davenport,Marc De Cea Falco,Pavan Bhargava,John Fini,Derek Van Orden,Roy Meade, Evelina Yeung,Rajeev Ram,Milos Popovic,Vladimir Stojanovic,Chen Sun

ECOC（2018）

引用 13|浏览82

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摘要

We present a high bandwidth-density photonic interconnect platform that transmits 1.05 Tbps/mm 2 using 0.83 pJ/bit, integrated in a 45nm SOI process, and a high-density multi-wavelength laser source.

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关键词

high-density multiwavelength laser source,bandwidth-dense,high bandwidth-density photonic interconnect platform,multiTbps optical I-O,bandwidth-dense low power electronic-photonic platform,SOI process,wavelength 45.0 nm

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