Unification of Instrumentation and EDA Tooling Platforms for Enabling Smart Chip-Package-PCB-Probe Arrays Co-Design Solutions using Advanced RFIC Technologies

This paper presents Chip-Package-PCB-Probe (Antenna) array Co-Design solutions using advanced RFIC technologies for emerging applications. Hardware implementation including innovative co-integration of probes (antennas) on-Chip, on-Package or on-PCB with Silicon-based CMOS/BiCMOS/SOI active building blocks circuitry, multiport switches and ADCs are proposed for realizing Near-Field scanning modules operating at RF and mm-Wave frequencies. Beyond the Chip-Package-PCB-Probe(Antenna) array Co-Design technologies, unification of instrumentation and EDA (Electronic Design Automation) tooling solutions is proposed for effective complementarities of modeling and measurement analysis. These complementarities render possible broadband characterization, validation and qualification of emerging wireless technologies accounting for DUT Deembedding backed-up by accurate and smart signal processing compensation algorithms. Energy and Entropy based metrics are proposed for Multiphysics analysis of Stochastic Field-Field Correlations both in Frequency and Time domains.