Inkjet-Printed Substrate Integrated Waveguides (Siw) With "Drill-Less" Vias On Paper Substrates

In this paper, an inkjet-printed substrate integrated waveguide (SIW) on commercially available cellulose paper is implemented for the first time. Unlike traditional inkjet-printed SIW's, it does not require any etching process to form the conductive side walls and utilizes the porosity of the paper to get through-substrate conduction. The frequency response of the waveguide along with its performance under bending is discussed in this paper, verifying that such a structure would be particularly suitable for Quality of Life and Internet of Things applications