Non-Uniform Temperature Distribution in Interconnects and Its Impact on Electromigration

We investigate the effect of electrically induced thermal load on interconnect reliability and aging. We propose new models for uniform and non-uniform temperature evolution and its steady state distribution in interconnects considering Joule heating and heat convection. The models are verified by comparing the results against those of finite element experiments. We apply our models to study material migration induced aging and failures. We discuss how different non-uniform temperature profiles affect interconnect lifetime. We propose new formulas for accurate temperature aware assessment of the mortality of interconnects. We demonstrate that neglecting thermal effects in modern technologies may lead to incorrect conclusions about interconnect mortality. We also provide a method for modeling the true mean time to failure based on underlying physics.