Impact of Line Mismatch on Two-Wire Deembedding Methods in Early Characterization of Emerging Interconnects

Minsoo Choi,Taehee Kim,Kyunghyun Lim,Byungsub Kim

IEEE Transactions on Components, Packaging and Manufacturing Technology（2019）

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摘要

In this paper, we analyze the impact of line mismatch on two-wire deembedding methods in early characterization of emerging interconnects. According to our analysis, mismatch of wires significantly reduces the accuracy of deembedding methods using two test wire structures and causes unexpectedly large error. Therefore, characterizing emerging interconnects with the deembedding methods is not relia...

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关键词

Wires,Reliability theory,Integrated circuit interconnections,Packaging,Information and communication technology

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