IBM POWER9 package technology and design.

Sungjun Chun,Wiren Dale Becker, Jon Casey, Steve Ostrander,Daniel Dreps,Jose Ale Hejase,Ryan Nett,Brian Beaman, Jason R. Eagle

IBM Journal of Research and Development（2018）

引用 17|浏览76

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摘要

The first-level package that contains the IBM POWER9 processor chip is designed to achieve the high computational performance needed for cognitive systems in a cost-effective design. The throughput data bandwidth of the POWER9 package for high-end scale-up systems is more than 1 TB/s, which is double the data bandwidth of the previous generation. This increase in bandwidth is achieved by introduci...

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关键词

Program processors,Computer architecture,Design methodology,System software,Cloud computing,Virtualization

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