The influence of Cu electrodeposition parameters on fabricating structurally uniform CNT-Cu composite wires

•Parametric analysis of CNT-Cu wire fabrication by 2-step Cu electrodeposition involving Cu seeding & growth is presented.•Both steps were needed to make structurally uniform composite wires with a solid Cu matrix and high vol% CNT filler.•Deposition current density, time, and electrolyte concentration affected composite wire Cu spatial distribution.•Parameters promoting Cu deposition within CNT wires over surface buildup yielded structurally uniform CNT-Cu wires.•The structurally uniform composite wires contained 45 vol% CNTs and were 2/3rd as light as Cu with ∼98wt% Cu.