Terminal metal inspection yield improvement YE: Yield enhancement

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)(2017)

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摘要
Power grids are designed with built in redundancy, but because of reliability concerns associated with the possibility that parts of the product power grid could require maximum current which would be constrained if any terminal metal connection is defective, all terminal metal connections in every product die are required to have 100% fully compliant terminal metal connections. The innovative method described in this paper applies an assessment of the amount of current carried by each terminal metal connection in the product die to create a map that identifies which terminal metal could be allowed to be defective and maintain product reliability and functionality. Application of this method at terminal metal connection defect inspection improves yield by taking advantage of power grid redundancy. The method identifies current carrying requirements for each TMC and creates a unique product terminal metal inspection map.
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关键词
Terminal Metal,Yield,Redundancy
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